EZconn Europe – an European contract manufacturer offers its customer a full range of services in development and manufacturing of microelectronic microsystems (MEMS), wafer level service and packaging service as well as special custom packaging of semiconductor devices for a variety of applications.
EZconn Europe GmbH was founded in June 2005 as a subsidiary of EZconn Corporation. Product development, manufacturing facility and marketing & sales is located in the Czech Republic – company EZconn Czech a.s., founded in May 2006.
The basis of the business is a highly sophisticated production line from Infineon Fiber Optics GmbH which was acquired by EZconn Corp (Taiwan).
Data-communications, Telecommunications, RF, Spaceship, Consumer Market Products
EZconn, your specialist on
Highly sophisticated packaging technologies and services
- Wafer level packaging
- TO Diode packaging (TO-CAN)
- OSA packaging (TOSA/ROSA)
- BIDI sub-assembly
- Transceiver assembly
- Transfer & Production Ramp up
- Custom packaging
- Bi-directional optical modules (BIDIs)
- Prototypes and samples
- High-volume series production