About us

EZconn Europe – an European contract manufacturer offers its customer a full range of services in development and manufacturing of microelectronic microsystems (MEMS), wafer level service and packaging service as well as special custom packaging of semiconductor devices for a variety of applications.

EZconn Europe GmbH was founded in June 2005 as a subsidiary of EZconn Corporation. Product development, manufacturing facility and marketing & sales is located in the Czech Republic – company EZconn Czech a.s., founded in May 2006.

The basis of the business is a highly sophisticated production line from Infineon Fiber Optics GmbH which was acquired by EZconn Corp (Taiwan).

Target markets:
Data-communications, Telecommunications, RF, Spaceship, Consumer Market Products

EZconn, your specialist on

  • Highly sophisticated packaging technologies and services
    • Wafer level packaging
    • TO Diode packaging (TO-CAN)
    • OSA packaging (TOSA/ROSA)
    • BIDI sub-assembly
    • Transceiver assembly
  • Services
    • R&D
    • Transfer & Production Ramp up
    • Custom packaging
  • Products
    • Micromodules
    • TO-Diodes
    • Bi-directional optical modules (BIDIs)
  • Prototypes and samples
  • High-volume series production