TO Level - Die-Attach Gluing

TO Level - Die-Attach Gluing

  • High speed mounting of dies onto TOs
  • Optical pattern recognition, edge search, circle matching, center search for precise mounting
  • Accuracy of ±10μm
  • Chip size down to 250μm x 250μm
  • Integrated post bonding inspection
  • Chip pick-up from wafer tape, UV tape, waffle pack or gel-pack
  • Glue stamping
  • Fully automated TO processing
  • Computer controlled TO mapping