TO Level - Wire-Bonding

TO Level - Wire-Bonding

  • Fully automated gold-wire bonding on TO level and other specific sockets
  • Ball bonding capabilities including BSOB, Tailless Bumps with Custom Shapes, Stacked Bumps, etc.
  • Wire thickness of 17μm up to 75μm
  • Aluminium-wire bonding for temperature-sensitive applications
  • In-house pull- and shear testing for superior quality control
  • Loop height measurement
  • User/application specific loop forms and wire lengths