Wafer Level - Burn-In & Probing

Wafer Level - Burn-In & Probing

  • Fully automated wafer testing
  • Controlled temperature range of 25° to 200°C
  • Up to 8'' wafer size probing
  • Measurement of standard electronic and optical characteristics
    • currents and voltages
    • breakthrough voltages on PIN/APD diodes and laser characteristics
    • output power
    • optical wavelengths
    • threshold currents
    • dark currents
    • reverse voltages
  • Device burn in on wafer level
  • Parallel processing of thousands devices per wafer
  • Integrated optical measurement and evaluation