Wafer Level - Dicing

Wafer Level - Dicing

  • Sawing of various substrate materials (e.g.: silicon, glass, ceramics) up to 8“ size
  • Specialized in sawing of fully assembled and wire bonded wafers
  • Integrated cleaning process for reduced operator interaction
  • Wafer handler for batch processing
  • Single and double spindle systems for mixed material processing
  • Automated cut control
    • position of cut
    • quality of edge
  • position of cut
  • quality of edge
  • Various forms like step-cut, bevel-cut, multi-index, multi-channel dicing
  • Integrated vision recognition system and blade exposure and damage control