Wafer Level - Die-Attach Soldering

Wafer Level - Die-Attach Soldering

  • Fully automated process
  • Special designed production equipment
  • Chip size down to 150µm x 150µm
  • Chip pick-up from wafer tape or from waffle pack
  • Optical pattern recognition for precise mounting with accuracy up to ±1µm
  • Laser soldering of components
  • Online chip selection by individual chip and process data
  • Active alignment of devices with integrated picture recognition system
  • Computer controlled wafer mapping