Wafer Level - Wire-Bonding

Wafer Level - Wire-Bonding

  • Automated gold- and aluminium-wire bonding on wafer level
  • Wedge-wedge bonding capabilities
  • Wire thickness of 17μm up to 75μm
  • In-house pull- and shear testing for superior quality control
  • Loop height measurement
  • Integrated wire deformation control
  • User/application specific loop forms and wire lengths
  • Computer controlled wafer mapping