Specific customer development of micro-systems
as well as packaging solutions by applying long term experience in semiconductor industry
including Optical & Electrical design and Temperature verification.
Cost effective, high precision wafer level assembly methods.
Encapsulation of the micro-modules in hermetically tight packages.
Micro-assembly of encapsulated components to more complex subunits with high precision alignment and mounting with laser welding.
Providing of single manufacturing processes as a part of customer's external manufacturing chain.
Complete optical and electrical characterization.
Flexible to modify standard testing methods to satisfy specific requirements.
Planning and realizaton of various tests for product qualification.
