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OSA Level – Burn-In
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OSA Level – Burn-In
R&D Competence
Wafer Level
Die-Attach Soldering
Die-Attach Gluing
Wire-Bonding
Burn-In & Probing
Dicing
3D-Geometry
Lens adjustment
TO Level
Die-Attach Gluing
Wire-Bonding
Hermetical sealing
Testing
Burn-In
OSA Level - BIDI® / BOSA Assembly
Fiber & Receptacle Alignment
Testing
Burn-In
Transceiver Assembly
Soldering, testing and assembling
Various laser diode current setting
Temperature range between 80 – 100 °C
Control of each diode status on control panel