R&D Competence
R&D competence
Development
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Customer specific development of micro-systems as well as packaging solutions for volume production by applying wafer-based production technology from semiconductor industry including Optical & Electrical desing, HF Simulation and Temperature verification.
Prototyping
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Prototyping can be performed on the equipment for volume production. Therefore there is no need for a technology transfer at the end of the development phase.
Manufacturing
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Cost effective, high precision micro-assembly of chips and micro-modules with wafer based assembly methods for volume manufacturing.
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Encapsulation of the micro-modules in hermetic tight packages in volume production.
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Assembly of encapsulated components to more complex subunits with high precision alignment and mounting with laser welding.
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Application of single manufacturing processes as part of an external manufacturing chain of the customer.
Characterization
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Execution of cost effective measurement and characterization of micro-assemblies using the on-wafer probing of electrical, optical and mechanical properties.
Burn-In
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Execution of cost effective Burn-In and aging tests with chip components and micro-assemblies on wafer scale.
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