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To Level - Burn-In
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To Level - Burn-In
R&D Competence
Wafer Level
Die-Attach Soldering
Die-Attach Gluing
Wire-Bonding
Burn-In & Probing
Dicing
3D-Geometry
Lens adjustment
TO Level
Die-Attach Gluing
Wire-Bonding
Hermetical sealing
Testing
Burn-In
OSA Level - BIDI® / BOSA Assembly
Fiber & Receptacle Alignment
Testing
Burn-In
Transceiver Assembly
Soldering, testing and assembling
Laser diode Burn-In
Various LD current settings
Temperature range: 80 – 100 °C
Control of each diodes status on control panel
PIN/APD Burn-In
Various backward voltage setting
Temperature range: 25 – 180 °C