- High speed mounting of dies onto TOs
- Optical pattern recognition, edge search, circle matching, center search for precise mounting
- Accuracy of ±10μm
- Chip size down to 250μm x 250μm
- Integrated post bonding inspection
- Chip pick-up from wafer tape, UV tape, waffle pack or gel-pack
- Glue stamping
- Fully automated TO processing
- Computer controlled TO mapping
