EZconn GmbH
About us
Services
Products
Career
Download
News & Press
Contact
Imprint
TO Level - Hermetical sealing
Homepage
>
Services
>
TO Level - Hermetical sealing
R&D Competence
Wafer Level
Die-Attach Soldering
Die-Attach Gluing
Wire-Bonding
Burn-In & Probing
Dicing
3D-Geometry
Lens adjustment
TO Level
Die-Attach Gluing
Wire-Bonding
Hermetical sealing
Testing
Burn-In
OSA Level - BIDI® / BOSA Assembly
Fiber & Receptacle Alignment
Testing
Burn-In
Transceiver Assembly
Soldering, testing and assembling
Two Input drying vacuum ovens with automatical mode
Welding chamber filled with purified nitrogen - fully controlled atmosphere
Control of humidity and oxygen in welding chamber
Control of welding power and welding distance
100% leak test after sealing
Bubble test