- Fully automated gold-wire bonding on TO level and other specific sockets
- Ball bonding capabilities including BSOB, Tailless Bumps with Custom Shapes, Stacked Bumps, etc.
- Wire thickness of 17μm up to 75μm
- Aluminium-wire bonding for temperature-sensitive applications
- In-house pull- and shear testing for superior quality control
- Loop height measurement
- User/application specific loop forms and wire lengths
