Wafer Level - Dicing
- Sawing of various substrate materials (e.g.: silicon, glass, ceramics) up to 8“ size
- Specialized in sawing of fully assembled and wire bonded wafers
- Integrated cleaning process for reduced operator interaction
- Wafer handler for batch processing
- Single and double spindle systems for mixed material processing
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Automated cut control
- position of cut
- quality of edge
- position of cut
- quality of edge
- Various forms like step-cut, bevel-cut, multi-index, multi-channel dicing
- Integrated vision recognition system and blade exposure and damage control
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