- High speed mounting of dies onto wafers
- Optical pattern recognition, edge search, circle matching, center search for precise mounting
- Accuracy of ±10μm
- Chip size down to 200μm x 200μm
- Integrated post bonding inspection
- Chip pick-up from wafer tape, UV tape, waffle pack or gel-pack
- Automatic wafer handling system for 25 wafers
- Glue stamping
- Fully automated wafer processing
- Computer controlled wafer and substrate mapping
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