- Fully automated process
- Special designed production equipment
- Chip size down to 150µm x 150µm
- Chip pick-up from wafer tape or from waffle pack
- Optical pattern recognition for precise mounting with accuracy up to ±1µm
- Laser soldering of components
- Online chip selection by individual chip and process data
- Active alignment of devices with integrated picture recognition system
- Computer controlled wafer mapping
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