Wafer Level - Lens adjustment
- Fully automated process
- Special designed production equipment
- Lens pick-up from wafer tape
- Optical pattern recognition for precise mounting with accuracy up to ±1µm
- Possibility of settings focal length (0-7mm) and tilting angle (0-5°) of laser beam
- Laser soldering of lenses
- Online lens selection by individual geometrical characteristics and process data
- Active or passive alignment of devices with integrated picture recognition system
- Computer controlled wafer mapping
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