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Wafer Level - 3D-Geometry
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Wafer Level - 3D-Geometry
R&D Competence
Wafer Level
Die-Attach Soldering
Die-Attach Gluing
Wire-Bonding
Burn-In & Probing
Dicing
3D-Geometry
Lens adjustment
TO Level
Die-Attach Gluing
Wire-Bonding
Hermetical sealing
Testing
Burn-In
OSA Level - BIDI® / BOSA Assembly
Fiber & Receptacle Alignment
Testing
Burn-In
Transceiver Assembly
Soldering, testing and assembling
Fully automated and computer controlled
Automated measurement of device surface characteristics
Measurement accuracy of ±1μm for x/y-axis and ± 0.1 μm for z-axis
Wafer scale for measurements high throughput
Application examples:
optical lenses
integrated 3D microsystems