Wafer Level - Die-Attach Gluing

Wafer Level - Die-Attach Gluing

  • High speed mounting of dies onto wafers
  • Optical pattern recognition, edge search, circle matching, center search for precise mounting
  • Accuracy of ±10μm
  • Chip size down to 200μm x 200μm
  • Integrated post bonding inspection
  • Chip pick-up from wafer tape, UV tape, waffle pack or gel-pack
  • Automatic wafer handling system for 25 wafers
  • Glue stamping
  • Fully automated wafer processing
  • Computer controlled wafer and substrate mapping