Wafer Level - Lens adjustment

Wafer Level - Lens adjustment

  • Fully automated process
  • Special designed production equipment
  • Lens pick-up from wafer tape
  • Optical pattern recognition for precise mounting with accuracy up to ±1µm
  • Possibility of settings focal length (0-7mm) and tilting angle (0-5°) of laser beam
  • Laser soldering of lenses
  • Online lens selection by individual geometrical characteristics and process data
  • Active or passive alignment of devices with integrated picture recognition system
  • Computer controlled wafer mapping